Field Service Engineer

Job Title: Field Service Engineer
COMPENSATION: $60-$83K
(10-20% bonus and a great year 25%)

Location: INTEL SITE: 2501 NE Century Blvd, Hillsboro, OR 97124. 99% this position is based here maybe 1% of the time they will be in the ASMPT office located at 15201 NW Greenbrier Pkwy B-5, Beaverton, OR 97006

ABOUT THE ROLE:
*12H x3 or 4days a week. Either 7am-7pm day shift or 7pm-7am night shift must be open to either shift. The only shift they can request is night shift.
This position may require after hours support and the candidate must be flexible to work after working hours. There is no specific amount of hours requested.
What they are doing:
· New products going into Intel (firebird TCB FLI Bonding)
· Installing and ramping them currently
· Tool install, root cause analysis, maintenance, troubleshooting, diagnostic…

Technology/products:
· Interconnect Technology
· IC assembly (interconnect) when you take a dye from a wafer that was fabricated in the wafer fab and singulate it – die bond it within a package (there are various ways to do that) WIRE BOND or FLIP CHIP BOND
· *Multiple forms of die bonding

What he’s looking for:
· They have doubled in size in the last year taking on Intel as a client
· A lot of FSE’s come from the wafer fab but those are FRONT-END…we are looking for backend, these are chip to wafer bonding – it’s different but this is still helpful (chip and die – bonding it to a wafer that gets simulated into an IC package). It does help that they don’t have to teach them about wafer fabs…

Logistics:
· They have one tool being used as a training site/facility – they will be putting more in there for low level development work/process development
o If they aren’t traveling, they will work onsite in Beaverton, Oregon or NM.
· Mexico – no plans of establishing an office/site
· No travel is really required. They will train onsite if they are in NM in OR for the first 2 weeks. They will put them in a hotel while they train during the day.
· Going onsite to Intel every day-this role lives on site at Intel
· Rental cars, hotels, per diem…when training.
· Room for growth: yes! 1-4 levels, application roles, sales roles, etc.

Duties and Responsibilities
• Install and qualify ASM’s Proprietary Semiconductor Equipment for high precision interconnection technology for IC Packaging
• Analyze, interpret and make critical decision on process and equipment related issues
• Interface with customers and internal suppliers to ensure customer issues are addressed in a timely manner
• Provide technical training courses using Company literature and system
• Support machine Installation and Qualification (IQ) activities as defined by our customers
• Understanding customer requirements to ensure system meets requirements
• Analyze experimental results and formulate professional technical reports for both internal and customer use
• Technical support (both internal and at customer site) of international customers and support in the post sales process
• Develop and implement processes at customer sites located worldwide
• Verbal, written and personal relationship communication skills
• Sound presentation skills with the ability to translate technical data into meaningful information
• Perform other duties as assigned
• Must be fluent in English, verbal and writing

Education and Experience Requirements
• Bachelors degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 – 2 years experience in IC Packaging and Assembly related equipment
Note: Semiconductor Microelectronics or Automation experience will be considered

Other Requirements
• Must be willing to travel up to 50% of the time. Travel includes both International and Domestic
• Must be able to work with minimal supervision
• Good written and oral communication and interpersonal skills
• Strong analytical background is a definite asset
• Microsoft Office Suite competency preferred

Interested candidates email your resume to alex@amtexenterprises.com & shabu@amtexenterprises.com